ASM X4S: High speed placement machine; components size 01005-87mm x 87mm max, PCB size 35” x 36”
Kohyoung AOI: 3D Solder Inspection, measure height and volume and area where solder paste deposit. Detect critical shadow problems.
DAGE X-ray: Inspection for solder bridge, open, cold solder and void, board size: 508mm x 444mm Max.
ALTEST Assembly
VISCOM X-RAY X8011-111: 3D x-ray inspection, 360-degree rotation, Die bonds, BGAs, flip chips, and voids in surface soldering
Flying Probe V8 Pilot: Front and Rear prob test in vertical position, PCB side 20mm x 20mm, 5mm board thickness, detect short and opens, pattern defects, voltage and frequency response
ALTEST ASSEMBLY
ALTEST ASSEMBLY
ASM Siplace machine XS: PZB Size 24” x 28”, Component Size 01005 to 87mm x 87mm max, High Speed Placement accuracy
BGA Rework Station: Remove and replace components size up to 87mm x 87mm max
ASSEMBLY EQUIPMENT
SAM (Scanning acoustic microscopy) non-destructive component test, Detect hidden defect.
ALTEST Assembly
ASM Siplace line1: Flexible High-mix production line, quick changeover product with just a button.
SMT line2: Flexible High-mix production line, faster placement platform and accuracy.
SMT line1: Flexible high-speed placement, large board production line
Wave line: from prototype to production build
Mycronic line: Flexible Low high mix production line, fast setup changeover.
Flying Probe line: Flexible test in vertical or horizontal position
Power Wave: Flexible with Leaded and Lead-free solder, quick changeover setup capabilities
Wave line: from prototype to production build
Wave line: flexible with selective wave
Wave machine: Power Wave with Leaded and Leadfree capability and Nitrogen line.
Selective Wave Machine: Ersa wave, no wave fixture required, nitrogen line, for soldering thick board
Electrovert wash machine: DI washing machine, wash clean and dry electronic board
