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BGA

REWORK

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Our BGA rework system addresses all
users with the highest requirements in terms of precision and process safety in electronic assembly rework applications.

Our BGA rework system provides a 1,800 W high-performance hybrid heating element to desolder and solder SMT components up to dimensions of 70 x 70 mm! 

Our BGA rework system allows us to offer a total in house service package while cutting down on time and increasing production efficiencies .

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BGA REWORK VIDEO

How the PCB Assembly Process Starts

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Send us your design and BOM

We'll review your design with our engineering and procurement teams

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We'll send you back a same-day quote

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We'll immediately begin production 

AS9100D

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ISO 13485:2016 Certification Icon

ISO 13485:2016

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ISO 9001:2015

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RoHS

COMPLIANT

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ITAR

REGISTERED

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Registered Member

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Registered Firm

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