Printed Circuit Board Fabrication
Altest is proud to source all its printed circuit boards (PCB) from TTM Technologies. Having them as our preferred supplier, has helped us to immediately begin the manufacturing of your design with a complete assurance on quality. Altest’s PCBA capabilities paired with quality PCB boards ensure a rapid and high-quality end-product.
PCB
RF & Microwave
HDI
Thermal Management
Flex & Rigid-Flex
IC Substrate
Mixed Materials
Multi Layer
PCB
PCB
- Multilayer up to 60+ layers
- Embedded passives
- Heavy copper up to 10 oz.
- Over 50 UL approved laminates
- Thickness up to 0.450"
- Thin core dielectrics
- Dimensions up to 30" x 54"
- Mixed dielectrics
RF & Microwave
RF & Microwave
- High frequency/bandwidth designs
- Planar and screened resistors
- Dimensions up to 24” x 48”
- Mixed dielectrics (hybrids)
- Dielectric foam
- Conductive paste
- Plated cavities
- Formed (conformal) PCBs
- Optical machining
HDI
HDI
- Up to 12L “any layer” stacked uVia Structure
- 1.6 / 2.0 mil line / space
- Wide material and surface finish selections
- 14 mil, 6L ultra-thin structure
- 3/7 mil uVia / Pad size
- 0.4 mm pitch BGA with 2 traces fanout
- Embedded, distributed and discrete passive components
Thermal Management
Thermal Management
- Passive and active designs
- Buried metal core constructions
- Externally mounted heatsinks
- Epoxy and B-stage films
- Thermal & conductive bonding
- Aluminum & copper base materials
Flex & Rigid-Flex
Flex & Rigid-Flex
- Type 2, 3 and 4 (double-sided, multilayer and rigid-flex)
- 30+ layers
- Dimensions up to 24" x 48"
- Epoxy fillet Bikini cut, bookbinder and loose-leaf construction
- Combination surface finishes
- Acrylic, epoxy and adhesive-less polyimide flex materials
- Over 50 rigid material options
- Thickness up 0.300"
IC Substrate
IC Substrate
- 2,4,6 Layers (2+2+2 stacked via)
- BT material
- Wire bonding (ENEPIG, Soft gold, Hard gold)
- Type: SIP,CSP,BOC & FC package
- Fine trace width/space 25/25um
- Thin board: 130um(2L), 170um(4L)
- Flip chip C4 pad
Mixed Materials
Mixed Materials
- Passive and active designs
- Buried metal core constructions
- Externally mounted heatsinks
- Epoxy and B-stage films
- Thermal & conductive bonding
- Aluminum & copper base materials
- Various surface finishes
Multi Layer
Multi Layer
- Type 2, 3 and 4 (double-sided, multilayer and rigid-flex)
- 30+ layers
- Dimensions up to 24" x 48"
- Epoxy fillet Bikini cut, bookbinder and loose-leaf construction
- Combination surface finishes
- Acrylic, epoxy and adhesive-less polyimide flex materials
- Over 50 rigid material options
- Thickness up 0.300"
