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Contact Information

info@altestcorp.com           

Tel: (408) 436-9900

898 Faulstich Court

San Jose, CA 95112

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PCB Fabrication

Altest is proud to have TTM Technologies as our preferred source for printed circuit boards (PCB). With our preferred suppliers we can rapidly begin manufacturing your design with the highest levels of quality. Altest's PCBA capabilities paired with quality PCB boards ensures a rapid and high-quality end product.

Product and Services

TTM offers a wide range of PCB products including conventional PCBs, HDI PCBs, flexible PCBs, rigid-flex PCBs, backplane assemblies, and IC substrates.

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Printed Circuit Board Fabrication

Conventional PCB

  • Multilayer up to 60+ layers

  • Embedded passives

  • Heavy copper up to 10 oz.

  • Over 50 UL approved laminates

  • Thickness up to 0.450"

  • Thin core dielectrics

  • Dimensions up to 30" x 54"

  • Mixed dielectrics

HDI

  • Up to 12L "any layer" stacked uVia Structure

  • 1.6 / 2.0 mil line / space

  • Wide material and surface finish selections

  • 14 mil, 6L ultra-thin structure

  • 3/7 mil uVia / Pad size

  • 0.4 mm pitch BGA with 2 traces fanout

  • Embedded, distributed and discrete passive components

Flex & Rigid-Flex

  • Type 2, 3 and 4 (double-sided, multilayer and rigid-flex)

  • 30+ layers

  • Dimensions up to 24" x 48"

  • Epoxy fillet

  • Bikini cut, bookbinder and loose-leaf construction

  • Combination surface finishes

  • Acrylic, epoxy and adhesive-less polyimide flex materials

  • Over 50 rigid material options

  • Thickness up 0.300"

RF & Microwave

  • High frequency/bandwidth designs

  • Planar and screened resistors

  • Dimensions up to 24" x 48"

  • Mixed dielectrics (hybrids)

  • Dielectric foam

  • Conductive paste

  • Plated cavities

  • Formed (conformal) PCBs

  • Optical machining

Thermal Management

  • Passive and active designs

  • Buried metal core constructions

  • Externally mounted heatsinks

  • Epoxy and B-stage films

  • Thermal & conductive bonding

  • Aluminum & copper base materials

  • Various surface finishes

  • In-house milling and bonding

IC Substrate

  • 2,4,6 Layers (2+2+2 stacked via)

  • BT material

  • Wire bonding (ENEPIG, Soft gold, Hard gold)

  • Type: SIP,CSP,BOC & FC package

  • Fine trace width/space 25/25um

  • Thin board: 130um(2L), 170um(4L)

  • Flip chip C4 pad

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