Reflow
Reflow is a process in PCB manufacturing that uses heat to melt solder paste and create permanent solder joints for surface-mount components.
What is Reflow Soldering?
Reflow soldering, also known as reflow, is a soldering technique used in Surface Mount Technology (SMT) to attach electronic components to printed circuit boards. It utilizes hot airflow to melt and reflow solder paste at high temperatures, forming good solder joints.
Paramax 15NZ12 BTU oven is a recirculation impingement, convection reflow soldering system for SMT process. Oven precisely heats and melts solder paste, bonding surface-mount components onto printed circuit boards with uniform temperature control and high production efficiency.
Heated Zone: 12 TOP / 12 Bottom
Conveyor Width: 2-18 In
Atmosphere: Air/ Nitrogen