How the PCB Assembly Process Works
Our assembly lines are geared towards flexibility. With multi-flex lines that allow for scaling and board sizes. Our assembly line allows us to work on any sized board without sacrificing speed and reliability. See these machines in person, book a tour, and see how Altest is one of the top PCBA companies in Silicon Valley.
The professional screen printing system we use is one of the world‘s most successful high-performance printers. Using the newest servo drives for all relevant movements including integrated linear scales leads to the best-in-class alignment repeatability and process capability.
Our reflow ovens provide optimized lead-free processing for the ultimate in productivity and efficiency. The exclusive closed-loop convection control provides precise heating and cooling, programmable heat transfer, and reduced nitrogen consumption
Our selective soldering systems are based on a modular platform. Depending on the application and on the throughput requirements called for, additional flux, preheat and solder modules can be integrated into the system. This allows for the use of quickly soldering boards without the need for pre-manufactured molds. While we do have other soldering machines this machine allows for the most amount of flexibility.
The placement systems we use are the standard for applications that require optimum speed and precision. It offers maximum productivity with its top-notch speed, minimal DPM rates, constant 01005 capacity, and continuous changeovers.
We use multiple Mycronic and Siplace SMT machines in our multi-flex assembly lines to ensure speed and flexibility for any board design.
Altest has traceability standards in place so that our clients are able to fully know where their boards are at in the assembly process.
We also offer an onsite component warehouse at over 100,000+ line items and with our own BOM checking system we are able to pull parts from it at the most competitive prices with no downtime.
Altest also has a dedicated onsite nitrogen production facility for available use.
Our BGA rework system addresses all
users with the highest requirements in terms of precision and process safety in electronic assembly rework applications.
Our BGA rework system provides a 1,800 W high-performance hybrid heating element to desolder and solder SMT components up to dimensions of 70 x 70 mm!
Our BGA rework system allows us to offer a total in house service package while cutting down on time and increasing production efficiencies .