SMT Assembly Services | Surface Mount Technology

SMT

Surface-Mount Technology (SMT): A method for manufacturing electronic circuit boards where electronic components are mounted directly onto the surface of the board, rather than being inserted through holes.

SMT (Surface Mount Technology)

A two-line SMT production using ASM machines ensures high throughput, precision, and flexibility. Known for speed, reliability, and advanced features like intelligent placement and Industry 4.0 integration, ASM machines boost productivity while maintaining top-quality control.

A single-line SMT setup using MYDATA machines is ideal for prototype production, offering flexibility, precision, and quick changeovers to efficiently handle small batches and frequent design iterations.

Vapor Phase Technology (Vapor Phase Reflow Soldering)

Vapor Phase Vacuum Reflow is one of the most reliable SMT soldering processes, offering uniform heat transfer, oxidation-free soldering, and ultra-low voiding performance for BGA, QFN, LED, and high-reliability electronics.

Multi Vacuum Process

With the innovative Multi Vacuum process, an assembly can be sequentially processed with multiple individually adjustable vacuum treatments.

Clean Vacuum Technology

With this patented process the vacuum process is performed outside the hot vapor zone.

< 1% Voids

Ultra-low void soldering for high-performance LED and thermal-critical assemblies.

How Vapor Phase Soldering Works

Process liquid is heated to its boiling point (e.g. 230°C for lead-free applications)
Boiling point is equal to the process temperature
Vapor condenses on the assembly and creates a closed liquid film
Liquid film excludes oxidation completely
Energy transfer is controlled through vapor creation and condensation
Assembly heats up automatically to vapor temperature
After soldering, assembly exits vapor zone and moves to cooling