Solder Paste Inspection (SPI)
Solder paste inspection (SPI) is a critical quality control step in surface-mount technology (SMT) electronics manufacturing that uses 3D scanning or optical imaging to verify that solder paste is applied correctly before components are placed
Solder Paste Inspection
2 KOH YOUNG Solder Paste Inspection Machines Ensures the accurate deposition of solder paste by detecting misalignment, insufficient paste, or excessive deposits early in the process.
Prevent defects like solder bridges or open circuits, reducing rework and scrap rates.
SPI improves production quality, enhances process control, and ensures consistent solder joint reliability, ultimately saving time and costs in high-volume manufacturing.